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 HD74LS279
Quadruple S-R Latches
REJ03D0474-0400 Rev.4.00 May 10, 2006
Features
* Ordering Information
Part Name HD74LS279P HD74LS279FPEL Package Type DILP-16 pin SOP-16 pin (JEITA) Package Code (Previous Code) PRDP0016AE-B (DP-16FV) Package Abbreviation P Taping Abbreviation (Quantity) -- EL (2,000 pcs/reel)
PRSP0016DH-B FP (FP-16DAV) Note: Please consult the sales office for the above package availability.
Pin Arrangement
1R 1S1 1S2 1Q 2R 2S 2Q GND
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10 9
VCC 4S 4R 4Q 3S2 3S1 3R 3Q
(Top view)
Rev.4.00, May 10, 2006, page 1 of 4
HD74LS279
Function Table
Inputs S** H L H L R H H L L Output Q Q0 H L H*
Notes: 1. H; high level, L; low level 2. Q0; The level of Q before the indidicated input conditions were established. 3. *; This output level is psodo stable; that is it may not persist when S and R inputs return to their inactive (high) level. 4. **; For latches with double S inputs; H; both S inputs high, L; one or both S inputs low.
Block Diagram (1/4)
R
S1 S2
Q
Absolute Maximum Ratings
Item Supply voltage Input voltage Power dissipation Storage temperature Symbol VCC VIN PT Tstg Ratings 7 7 400 -65 to +150 Unit V V mW C
Note: Voltage value, unless otherwise noted, are with respect to network ground terminal.
Recommended Operating Conditions
Item Supply voltage Output current Operating temperature Symbol VCC IOH IOL Topr Min 4.75 -- -- -20 Typ 5.00 -- -- 25 Max 5.25 -400 8 75 Unit V A mA C
Rev.4.00, May 10, 2006, page 2 of 4
HD74LS279
Electrical Characteristics
(Ta = -20 to +75 C)
Item Input voltage Symbol VIH VIL VOH Output voltage VOL IIH IIL min. 2.0 -- 2.7 -- -- -- -- -- -20 -- -- typ.* -- -- -- -- -- max. -- 0.8 -- 0.4 0.5 20 -0.4 0.1 -100 7 -1.5 Unit V V V V A mA mA mA mA V Condition
VCC = 4.75 V, VIH = 2 V, VIL = 0.8 V, IOH = -400 A IOL = 4 mA VCC = 4.75 V, VIH = 2 V, IOL = 8 mA VIL = 0.8 V VCC = 5.25 V, VI = 2.7 V VCC = 5.25 V, VI = 0.4 V VCC = 5.25 V, VI = 7 V VCC = 5.25 V VCC = 5.25 V VCC = 4.75 V, IIN = -18 mA
Input current
II Short-circuit output current IOS -- Supply current** ICC 3.8 Input clamp voltage VIK -- Notes: * VCC = 5 V, Ta = 25C ** ICC is measured with all R inputs grounded, all S inputs at 4.5 V, and all outputs open.
Switching Characteristics
(VCC = 5 V, Ta = 25C)
Item Propagation delay time Symbol tPLH tPHL tPHL Inputs S R Output Q min. -- -- -- typ. 12 13 15 max. 22 21 27 Unit ns Condition CL = 15 pF, RL = 2 k
Note: Refer to Test Circuit and Waveform of the Common Item "TTL Common Matter (Document No.: REJ27D00050100)".
Rev.4.00, May 10, 2006, page 3 of 4
HD74LS279
Package Dimensions
JEITA Package Code P-DIP16-6.3x19.2-2.54 RENESAS Code PRDP0016AE-B Previous Code DP-16FV MASS[Typ.] 1.05g
D
16
9
1 0.89 b3
8
Z
A1
A
E
Reference Symbol
Dimension in Millimeters
Min
e
bp
e1
c
( Ni/Pd/Au plating )
e1 D E A A1 bp b3 c e Z L
Nom Max 7.62 19.2 20.32 6.3 7.4 5.06
L
0.51 0.40 0.48 0.56 1.30 0.19 0.25 0.31 0 15 2.29 2.54 2.79 1.12 2.54
JEITA Package Code P-SOP16-5.5x10.06-1.27
RENESAS Code PRSP0016DH-B
Previous Code FP-16DAV
MASS[Typ.] 0.24g
*1
D F 9
16
NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET.
bp
HE
E
Index mark
*2
Terminal cross section ( Ni/Pd/Au plating )
1 Z e
*3
8 bp x M L1
Reference Dimension in Millimeters Symbol
c
A1
y
L
Detail F
D E A2 A1 A bp b1 c c1 HE e x y Z L L1
Min Nom Max 10.06 10.5 5.50
0.00 0.10 0.20 2.20 0.34 0.40 0.46 0.15 0.20 0.25 0 8 7.50 7.80 8.00 1.27 0.12 0.15 0.80 0.50 0.70 0.90 1.15
Rev.4.00, May 10, 2006, page 4 of 4
A
Sales Strategic Planning Div.
Keep safety first in your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
RENESAS SALES OFFICES
Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology (Shanghai) Co., Ltd. Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120 Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
http://www.renesas.com
Renesas Technology Malaysia Sdn. Bhd Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510
(c) 2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .6.0


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